The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.

Over the years, the field of VLSI circuits has witnessed remarkable advancements. One such breakthrough is the advent of 3D integration, which has revolutionized the way integrated circuits are ...

This paper aims to emphasize on the importance of integrating design for failure analysis in the layout considerations during the IC development process. It will have a brief overview on the ...

If the first 10 percent of design effort accounts for 90 percent of project success, how might that reality change the design effort? How does it change an owner’s expectations of how the team works ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

The number of technologies that could go into a mobile phone is huge and growing all of the time from short-range wireless technologies to almost ubiquitous functions such as cameras and Internet ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. In design and construction, the days of having a single ...