Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
Abstract: As the human race entered the 5th Industrial Revolution era, the collaboration between humans and advanced technologies flourished at a speed that no one ever imagined before. The ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback